Microelectronic imaging units and methods of manufacturing microelectronic imaging units

ABSTRACT

Microelectronic imaging units and methods for manufacturing microelectronic imaging units are disclosed herein. In one embodiment, a method includes placing a plurality of singulated imaging dies on a support member. The individual imaging dies include an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The method further includes disposing a plurality of discrete stand-offs on the support member. The discrete stand-offs are arranged in arrays relative to corresponding imaging dies. The method further includes electrically connecting the external contacts of the imaging dies to corresponding terminals on the support member, and attaching a plurality of covers to corresponding stand-off arrays so that the covers are positioned over the image sensors.

TECHNICAL FIELD

The present invention is related to microelectronic imaging units havingsolid state image sensors and methods for manufacturing such imagingunits.

BACKGROUND

Microelectronic imagers are used in digital cameras, wireless deviceswith picture capabilities, and many other applications. Cell phones andPersonal Digital Assistants (PDAs), for example, are incorporatingmicroelectronic imagers for capturing and sending pictures. The growthrate of microelectronic imagers has been steadily increasing as theybecome smaller and produce better images with higher pixel counts.

Microelectronic imagers include image sensors that use Charged CoupledDevice (CCD) systems, Complementary Metal-Oxide Semiconductor (CMOS)systems, or other solid state systems. CCD image sensors have beenwidely used in digital cameras and other applications. CMOS imagesensors are also quickly becoming very popular because they are expectedto have low production costs, high yields, and small sizes. CMOS imagesensors can provide these advantages because they are manufactured usingtechnology and equipment developed for fabricating semiconductordevices. CMOS image sensors, as well as CCD image sensors, areaccordingly “packaged” to protect their delicate components and toprovide external electrical contacts.

FIG. 1 is a schematic side cross-sectional view of a conventionalmicroelectronic imaging unit 2 including an imaging die 10, a chipcarrier 30 carrying the die 10, and a cover 50 attached to the carrier30 over the die 10. The imaging die 10 includes an image sensor 12 and aplurality of bond-pads 16 operably coupled to the image sensor 12. Thechip carrier 30 has a base 32, sidewalls 34 projecting from the base 32,and a recess 36 defined by the base 32 and sidewalls 34. The die 10 isaccordingly sized to be received within the recess 36 and attached tothe base 32. The chip carrier 30 further includes an array of terminals18 on the base 32, an array of contacts 24 on an external surface 38,and a plurality of traces 22 electrically connecting the terminals 18 tocorresponding external contacts 24. The terminals 18 are positionedbetween the die 10 and the sidewalls 34 so that wire-bonds 20 canelectrically couple the terminals 18 to the corresponding bond-pads 16on the die 10.

One problem with the microelectronic imaging unit 2 illustrated in FIG.1 is that the die 10 must be sized and configured to fit within therecess 36 of the chip carrier 30. A die having a different shape and/orsize requires a different chip carrier. As such, manufacturing imagingunits with dies having different sizes requires fabricating variousconfigurations of chip carriers and significantly retooling themanufacturing process.

Another problem with conventional microelectronic imaging units is thatthey have relatively large footprints. For example, the footprint of theimaging unit 2 in FIG. 1 is the surface area of the base 32 of the chipcarrier 30, which is significantly larger than the surface area of thedie 10. Accordingly, the footprint of conventional microelectronicimaging units can be a limiting factor in the design and marketabilityof picture cell phones or PDAs because these devices are continuallybeing made smaller in order to be more portable. Therefore, there is aneed to provide microelectronic imaging units with smaller footprints.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic side cross-sectional view of a conventionalmicroelectronic imaging unit in accordance with the prior art.

FIGS. 2-5 illustrate stages in one embodiment of a method formanufacturing a plurality of microelectronic imaging units in accordancewith the invention.

FIG. 2 is a schematic side cross-sectional view of an assembly includinga plurality of imaging dies arranged in an array on a support member.

FIG. 3A is a schematic top plan view of the assembly after forming aplurality of discrete stand-offs on the support member.

FIG. 3B is a schematic side cross-sectional view of the assembly takensubstantially along the line A-A of FIG. 3A.

FIG. 4 is a schematic side cross-sectional view of the assembly afterattaching a plurality of covers to corresponding arrays of stand-offs.

FIG. 5 is a schematic side cross-sectional view of the assembly afterdisposing a flowable material around the perimeter of the individualimaging dies.

FIG. 6 is a schematic side cross-sectional view of an assembly includinga plurality of imaging units in accordance with another embodiment ofthe invention.

FIG. 7 is a schematic side cross-sectional view of an assembly includinga plurality of imaging units in accordance with another embodiment ofthe invention.

FIG. 8 is a schematic top plan view of an assembly including a pluralityof imaging dies attached to a support member in accordance with anotherembodiment of the invention.

DETAILED DESCRIPTION

A. Overview

The following disclosure describes several embodiments of methods formanufacturing microelectronic imaging units and microelectronic imagingunits that are formed using such methods. One aspect of the invention isdirected toward methods for manufacturing a plurality of microelectronicimaging units. An embodiment of one such method includes placing aplurality of singulated imaging dies on a support member. The individualimaging dies include an image sensor, an integrated circuit operablycoupled to the image sensor, and a plurality of external contactsoperably coupled to the integrated circuit. The method further includesdisposing a plurality of discrete stand-offs on the support member. Thediscrete stand-offs are arranged in arrays relative to correspondingimaging dies. The method further includes electrically connecting theexternal contacts of the imaging dies to corresponding terminals on thesupport member and attaching a plurality of covers to correspondingstand-off arrays so that the covers are positioned over the imagesensors. The stand-offs in the individual arrays can be spaced apart sothat adjacent stand-offs define openings between the cover and thesupport member. The method can further include flowing an underfillmaterial into the openings between adjacent stand-offs.

Another aspect of the invention is directed toward methods formanufacturing a microelectronic imaging unit. In one embodiment, amethod includes coupling an imaging die to a support member having aplurality of terminals. The imaging die includes an image sensor, anintegrated circuit operably coupled to the image sensor, and a pluralityof external contacts operably coupled to the integrated circuit. Themethod further includes disposing a plurality of stand-offs on thesupport member so that at least some of the terminals of the supportmember are positioned outboard and/or directly between adjacentstand-offs. The method further includes electrically connecting theexternal contacts of the imaging die to corresponding terminals on thesupport member and attaching a cover to the stand-offs with the coverover the image sensor.

Another aspect of the invention is directed toward a microelectronicimaging unit. One embodiment of such an imaging unit includes a supportmember, an imaging die attached to the support member, and a pluralityof stand-offs on the support member. The imaging die includes an imagesensor, an integrated circuit operably coupled to the image sensor, anda plurality of external contacts operably coupled to the integratedcircuit. The individual stand-offs are spaced apart from each other onthe support member so that adjacent stand-offs define an opening. Theimaging unit further includes a cover positioned over the image sensorand a flowable material disposed in the openings between the stand-offs.

Specific details of several embodiments of the invention are describedbelow with reference to CMOS imaging units to provide a thoroughunderstanding of these embodiments, but other embodiments can use CCDimaging units or other types of solid state imaging devices. Severaldetails describing structures or processes that are well known and oftenassociated with other types of microelectronic devices are not set forthin the following description for purposes of brevity. Moreover, althoughthe following disclosure sets forth several embodiments of differentaspects of the invention, several other embodiments of the invention canhave different configurations or different components than thosedescribed in this section. As such, it should be understood that theinvention may have other embodiments with additional elements or withoutseveral of the elements described below with reference to FIGS. 2-8.

B. Embodiments of Methods for Manufacturing Microelectronic ImagingUnits

FIGS. 2-5 illustrate stages in one embodiment of a method formanufacturing a plurality of microelectronic imaging units. For example,FIG. 2 is a schematic side cross-sectional view of an assembly 100including a plurality of microelectronic imaging dies 110 (only two areshown) arranged in an array on a support member 160. The imaging dies110 include a first side 111, a second side 113 opposite the first side111, and a plurality of ends 115 connecting the first side 111 to thesecond side 113. The second side 113 of the dies 110 is attached to thesupport member 160 with an adhesive 120, such as an adhesive film,epoxy, or other suitable material.

The imaging dies 110 further include an image sensor 112 on the firstside 111, an integrated circuit 114 (shown schematically) operablycoupled to the image sensor 112, and a plurality of external contacts116 (e.g., bond-pads) operably coupled to the integrated circuit 114.The image sensors 112 can be CMOS devices or CCD image sensors forcapturing pictures or other images in the visible spectrum. The imagesensors 112 may also detect radiation in other spectrums (e.g., IR or UVranges). In the illustrated embodiment, the imaging dies 110 on thesupport member 160 have the same structure; however, in severalembodiments, the imaging dies 110 on the support member can havedifferent features to perform different functions.

The support member 160 can be a lead frame or a substrate, such as aprinted circuit board, for carrying the imaging dies 110. In theillustrated embodiment, the support member 160 includes a first side 162having a plurality of terminals 166 and a second side 164 having aplurality of pads 168. The terminals 166 can be arranged in arrays forattachment to corresponding external contacts 116 on the dies 110, andthe pads 168 can be arranged in arrays for attachment to a plurality ofconductive couplers (e.g., solder balls). The support member 160 furtherincludes a plurality of conductive traces 169 electrically coupling theterminals 166 to corresponding pads 168.

FIG. 3A is a schematic top plan view of the assembly 100 after forming aplurality of discrete stand-offs 130 on the first side 162 of thesupport member 160. The stand-offs 130 are arranged in arrays around theperimeter of corresponding imaging dies 110. For example, in theillustrated embodiment, each array includes four stand-offs 130positioned proximate to the corners of the corresponding imaging die110. In other embodiments, such as the embodiment described below withreference to FIG. 8, the stand-offs can be arranged in arrays with otherconfigurations.

In one aspect of the illustrated embodiment, the stand-offs 130 arearranged such that the terminals 166 on the support member 160 arepositioned outboard and/or directly between adjacent stand-offs 130. Forexample, a first stand-off 130 a and a second stand-off 130 b arearranged on the support member 160 so that a group of terminals 166 aare positioned directly between the first and second stand-offs 130 a-b.Alternatively, the first and second stand-offs 130 a-b and/or theterminals 166 a can be arranged such that one or more of the terminals166 a are positioned outboard the first and second stand-offs 130 a-b(see, e.g., line O-O shown in phantom). In either case, the terminals166 a are not positioned inboard the first and second stand-offs 130 a-bin some embodiments. However, in other embodiments, the stand-offs 130can be arranged such that some but not all of the terminals 166 areinboard the adjacent stand-offs 130 (see, e.g., line I-I shown inphantom).

FIG. 3B is a schematic side cross-sectional view of the assembly 100taken substantially along the line A-A of FIG. 3A. The stand-offs 130are constructed to have a predetermined height H₁ for supporting coversat a precise distance over the image sensors 112. As such, thepredetermined height H₁ of the stand-offs 130 can be greater than aheight H₂ of the imaging dies 110. Moreover, the stand-offs 130 can bemade of epoxy and/or other dimensionally stable materials so that theirheight H₁ remains generally constant during use.

The stand-offs 130 can be formed on the support member 160 by depositionprocesses, three-dimensional stereolithography processes, molding, orother suitable methods. Alternatively, the stand-offs 130 can be formedseparate from the support member 160 and then attached to the supportmember 160 with an adhesive. In several embodiments, the stand-offs 130can be an integral portion of the support member 160.

Referring to both FIGS. 3A and 3B, after attaching the imaging dies 110to the support member 160, the contacts 116 on the imaging dies 110 arewire-bonded to corresponding terminals 166 on the support member 160.The imaging dies 110 can be wire-bonded to the support member 160 beforeor after the stand-offs 130 are disposed on the support member 160. Theindividual wire-bonds 140 include a proximate portion 142 attached tothe contact 116 and a distal portion 144 attached to the terminal 166.Because the terminals 166 in the illustrated embodiment are positioneddirectly between adjacent stand-offs 130, the distal portions 144 of thewire-bonds 140 in this embodiment are also positioned directly betweenadjacent stand-offs 130.

FIG. 4 is a schematic side cross-sectional view of the assembly 100after attaching a plurality of covers 150 to corresponding arrays ofstand-offs 130. The individual covers 150 are supported by an array ofstand-offs 130 and positioned over the corresponding image sensors 112.The individual covers 150 are spaced apart from the image sensors 112 bya predetermined and precise distance G, which can correspond to thedifference between the height H₁ of the stand-offs 130 and the height H₂of the imaging die 110. The covers 150 can be glass, quartz, or anothersuitable material that is transmissive to the desired spectrum ofradiation. The covers 150, for example, can further include one or moreanti-reflective films and/or filters.

Although in the illustrated embodiment the stand-offs 130 have agenerally flat top surface 132 to support the cover 150, in otherembodiments, the top surface 132 can include reference and/or alignmentfeatures to further align the cover 150 relative to the image sensor112. Additionally, the individual covers 150 can be positioned overcorresponding dies 110 as shown in FIG. 4, or the cover can be a singlepane covering multiple dies 110. In several embodiments, the stand-offs130 can be an integral portion of the covers 150. In any of theseembodiments, adjacent stand-offs 130 in individual arrays defineopenings 170 between the cover 150 and the support member 160.

FIG. 5 is a schematic side cross-sectional view of the assembly 100after disposing a flowable material 180 around the perimeter of theindividual imaging dies 110. The flowable material 180 can be dispensedonto the support member 160 via a gap between adjacent covers 150 and/orbetween the covers 150 and the support member 160 at the perimeter ofthe support member 160. The flowable material 180 wicks into and throughthe openings 170 toward the imaging dies 110. In the illustratedembodiment, the flowable material 180 encapsulates and covers the ends115 and an outer perimeter portion of the first side 111 of the dies110. As such, the assembly 100 can have cells 186 filled with air oranother gas between the covers 150 and the dies 110 over the imagesensors 112. Air cells 186 can be useful in applications in which theimage sensors 112 include microlenses. In other embodiments, such as theembodiment described below with reference to FIG. 6, the flowablematerial 180 can extend across the first side 111 of the imaging dies110 and cover the image sensors 112.

In the embodiment shown in FIG. 5, the flowable material 180 can be anopaque or transparent underfill material that enhances the integrity ofthe joint between the individual covers 150 and the support member 160.Moreover, the flowable material 180 can protect the components frommoisture, chemicals, and other contaminants. In embodiments in which theflowable material 180 is an underfill material, the underfill materialcan include filler particles selected to (a) increase the rigidity ofthe material, (b) modify the coefficient of thermal expansion of thematerial, and/or (c) alter the viscosity of the material. Suitableunderfill materials include epoxy and other similar materials, such asthose made by Henkel Loctite Corporation of Rocky Hill, Conn., andNagase America Corporation of New York, N.Y.

After depositing the flowable material 180, the assembly 100 can beheated to at least partially cure the flowable material 180. Moreover, aplurality of conductive couplers 190 (shown in hidden lines) can beformed on corresponding pads 168 of the support member 160. After curingthe flowable material 180, the assembly 100 can be cut along lines B-Bby scribing, sawing, or another suitable process to singulate theindividual imaging units 102. Alternatively, the imaging units 102 canbe singulated before the flowable material 180 is deposited between thecovers 150 and the support member 160.

One feature of several embodiments of the imaging units 102 illustratedin FIG. 5 is that the distal portion 144 of the wire-bonds 140 and theterminals 166 on the support member 160 are positioned directly betweenadjacent stand-offs 130. An advantage of this feature is that thefootprint of the individual imaging units 102 is smaller than thefootprint of conventional imaging units. The reduced footprint of theimaging units 102 is particularly advantageous for picture cell phones,PDAs, or other applications where space is limited. In prior artdevices, such as the imaging unit 2 illustrated in FIG. 1, the terminals18 and the wire-bonds 20 are inboard the sidewalls 34 of the chipcarrier 30, which increases the footprint of the imaging unit 2.

One feature of the method for manufacturing imaging units 102illustrated in FIGS. 2-5 is that the support member 160 can carryimaging dies 110 with different sizes and/or configurations. Anadvantage of this feature is that the method can be easily adapted tohandle various configurations of imaging dies without significantchanges to the fabrication process. Prior art methods, such as themethod required to form the imaging unit 2 described above withreference to FIG. 1, may require significant retooling because the chipcarriers 30 can only carry imaging dies 10 with a certain shape andsize.

Another advantage of the method for manufacturing imaging units 102illustrated in FIGS. 2-5 is that the method is expected to significantlyenhance the efficiency of the manufacturing process because a pluralityof imaging units 102 can be fabricated simultaneously using highlyaccurate and efficient processes developed for packaging andmanufacturing semiconductor devices. This method of manufacturingimaging units 102 is also expected to enhance the quality andperformance of the imaging units 102 because the semiconductorfabrication processes can reliably produce and assemble the variouscomponents with a high degree of precision. As such, several embodimentsof the method are expected to significantly reduce the cost forassembling microelectronic imaging units 102, increase the performanceof the imaging units 102, and produce higher quality imaging units 102.

C. Additional Embodiments of Microelectronic Imaging Units

FIG. 6 is a schematic side cross-sectional view of an assembly 200including a plurality of microelectronic imaging units 202 in accordancewith another embodiment of the invention. The microelectronic imagingunits 202 are generally similar to the microelectronic imaging units 102described above with reference to FIG. 5. However, unlike the imagingunits 102 described above, the illustrated imaging units 202 shown inFIG. 6 include a flowable material 280 disposed completely across thefirst side 111 of the imaging dies 110. As such, the flowable material280 covers the image sensors 112 and fills the volume between the covers150 and the imaging dies 110. The flowable material 280 can be anoptical grade underfill material with a high transparency to eliminateor reduce light scattering and/or the loss of images. In applications inwhich the image sensors 112 have pixels with a smaller size, theflowable material 280 can have a higher refractive index to assist infocusing the light for the pixels.

One feature of the imaging units 202 illustrated in FIG. 6 is that theflowable material 280 can be dimensionally stable over a wide range oftemperatures. An advantage of this feature is that the distance betweenthe cover 150 and the image sensor 112 remains generally consistent,even if the imaging units 202 operate in an environment that experiencessignificant changes in ambient temperature. If a temperature change wereto cause the medium between the cover 150 and the image sensor 112 toexpand or contract, the associated change in the distance between thecover 150 and the image sensor 112 could skew the image and reduce thelife of the imaging unit 202 due to fatigue.

FIG. 7 is a schematic side cross-sectional view of an assembly 300including a plurality of imaging units 302 in accordance with anotherembodiment of the invention. The illustrated imaging units 302 aregenerally similar to the imaging units 102 described above withreference to FIG. 5. The illustrated imaging units 302, however, includea plurality of generally spherical stand-offs 330 arranged in arraysrelative to corresponding imaging dies 110. To form the illustratedstand-offs 330, a precise volume of material can be dispensed onto thefirst side 162 of the support member 160 so that the stand-offs 330support the covers 150 at a desired height. In additional embodiments,the stand-offs 330 can have other shapes and/or configurations forsupporting the covers 150 at the precise predetermined height.

FIG. 8 is a schematic top plan view of an assembly 400 including aplurality of imaging dies 110 attached to a support member 460 inaccordance with another embodiment of the invention. The assembly 400 isgenerally similar to the assembly 100 described above with reference toFIG. 3A. For example, the illustrated assembly 400 includes a pluralityof stand-offs 430 arranged in arrays on the support member 460 aroundthe perimeter of corresponding imaging dies 110. In the illustratedembodiment, however, each array includes three stand-offs 430 positionedin a generally triangular configuration. The stand-offs 430 are arrangedso that terminals 466 on the support member 460 are positioned outboardand/or directly between adjacent stand-offs 430. For example, a firststand-off 430 a and a second stand-off 430 b are arranged such that agroup of terminals 466 a are positioned outboard the first and secondstand-offs 430 a-b. In additional embodiments, the stand-offs 430 can bearranged in arrays with other configurations for supporting the covers.

From the foregoing, it will be appreciated that specific embodiments ofthe invention have been described herein for purposes of illustration,but that various modifications may be made without deviating from thespirit and scope of the invention. For example, the microelectronicimaging units can have any combination of the features described above.Accordingly, the invention is not limited except as by the appendedclaims.

1-46. (canceled)
 47. A plurality of microelectronic imaging units,comprising: a support member; a plurality of imaging dies attached tothe support member, the individual imaging dies comprising an imagesensor, an integrated circuit operably coupled to the image sensor, anda plurality of external contacts operably coupled to the integratedcircuit; a plurality of discrete stand-offs arranged in arrays on thesupport member relative to corresponding imaging dies; and a pluralityof covers over corresponding stand-off arrays and covering theassociated image sensors.
 48. The microelectronic imaging units of claim47 wherein: the stand-offs in the individual arrays are spaced apart sothat adjacent stand-offs define openings between the covers and thesupport member; and the imaging units further comprise a flowablematerial in the openings between adjacent stand-offs.
 49. Themicroelectronic imaging units of claim 47 wherein: the support memberincludes a plurality of terminals arranged in arrays relative to theimaging dies; the imaging units further comprise a plurality ofwire-bonds electrically coupling the contacts on the dies tocorresponding terminals on the support member, the individual wire-bondsincluding a distal end attached to the corresponding terminal; and atleast some of the distal ends are positioned outboard and/or directlybetween adjacent stand-offs.
 50. The microelectronic imaging units ofclaim 47 wherein the support member includes a plurality of terminalsarranged in arrays relative to the imaging dies, and wherein at leastsome of the terminals in each array are positioned outboard and/ordirectly between adjacent stand-offs.
 51. The microelectronic imagingunits of claim 47 wherein the stand-offs comprise at least fourstand-offs.
 52. The microelectronic imaging units of claim 47 whereinthe stand-offs comprise at least three stand-offs.
 53. Themicroelectronic imaging units of claim 47 wherein the stand-offs have afirst height and the imaging dies have a second height less than thefirst height.
 54. The microelectronic imaging units of claim 47 whereinthe stand-offs are an integral portion of the corresponding covers. 55.The microelectronic imaging units of claim 47 wherein the stand-offs arean integral portion of the support member.
 56. The microelectronicimaging units of claim 47 wherein: the individual imaging dies have fourcorners; and the stand-offs in individual arrays are arranged with astand-off attached to the support member at the four corners of thecorresponding imaging die.
 57. A microelectronic imaging unit,comprising: a support member having an array of terminals; an imagingdie attached to the support member, the imaging die comprising an imagesensor, an integrated circuit operably coupled to the image sensor, anda plurality of external contacts operably coupled to the integratedcircuit and electrically coupled to corresponding terminals on thesupport member; a plurality of stand-offs on the support member arrangedso that at least some of the terminals are positioned outboard and/ordirectly between adjacent stand-offs; and a cover attached to thestand-offs and disposed over the image sensor.
 58. The microelectronicimaging unit of claim 57 wherein: the stand-offs are spaced apart sothat adjacent stand-offs define openings between the cover and thesupport member; and the imaging unit further comprises a flowablematerial in the openings between adjacent stand-offs.
 59. Themicroelectronic imaging unit of claim 57, further comprising a pluralityof wire-bonds electrically coupling the contacts on the die to thecorresponding terminals on the support member, the individual wire-bondsincluding a distal end attached to the corresponding terminal, whereinat least some of the distal ends are positioned outboard and/or directlybetween adjacent stand-offs.
 60. The microelectronic imaging unit ofclaim 57 wherein the stand-offs have a first height and the imaging diehas a second height less than the first height.
 61. The microelectronicimaging unit of claim 57 wherein: the imaging die has four corners; andthe stand-offs are arranged on the support member at the four comers ofthe imaging die.
 62. The microelectronic imaging unit of claim 57wherein: the stand-offs are spaced apart so that adjacent stand-offsdefine openings between the cover and the support member; and theimaging unit further comprises an encapsulant in the openings betweenadjacent stand-offs and circumscribing the imaging die.
 63. Amicroelectronic imaging unit, comprising: a support member having anarray of terminals; an imaging die attached to the support member, theimaging die comprising an image sensor, an integrated circuit operablycoupled to the image sensor, and a plurality of external contactsoperably coupled to the integrated circuit; a plurality of stand-offs onthe support member; a plurality of wire-bonds electrically coupling theexternal contacts of the die to corresponding terminals on the supportmember, wherein one end of at least some of the individual wire-bonds ispositioned outboard and/or between adjacent stand-offs; and a cover overthe stand-offs and the image sensor.
 64. The microelectronic imagingunit of claim 63 wherein: the stand-offs are spaced apart so thatadjacent stand-offs define openings between the cover and the supportmember; and the imaging unit further comprises a flowable material inthe openings between adjacent stand-offs.
 65. The microelectronicimaging unit of claim 63 wherein at least some of the terminals arepositioned outboard and/or directly between adjacent stand-offs.
 66. Amicroelectronic imaging unit, comprising: a support member; an imagingdie attached to the support member, the imaging die comprising an imagesensor, an integrated circuit operably coupled to the image sensor, anda plurality of external contacts operably coupled to the integratedcircuit; a plurality of stand-offs on the support member, the individualstand-offs being spaced apart to define openings; a cover attached tothe stand-offs and disposed over the image sensor; and a fill materialin the openings between the stand-offs.
 67. The microelectronic imagingunit of claim 66 wherein the fill material comprises underfill material.68. The microelectronic imaging unit of claim 66 wherein the fillmaterial encapsulates the imaging die.
 69. The microelectronic imagingunit of claim 66 wherein the fill material covers the image sensor andfills a gap between the cover and the imaging die.
 70. Themicroelectronic imaging unit of claim 66 wherein the fill materialcomprises a flowable material.
 71. The microelectronic imaging unit ofclaim 66 wherein: the support member includes a plurality of terminalsarranged in an array; and the imaging unit further comprises a pluralityof wire-bonds electrically coupling the contacts on the die tocorresponding terminals on the support member, the individual wire-bondsincluding a distal end attached to the corresponding terminal, and atleast some of the distal ends are positioned outboard and/or directlybetween adjacent stand-offs.
 72. The microelectronic imaging unit ofclaim 66 wherein the support member includes a plurality of terminalsarranged in an array, and at least some of the terminals are positionedoutboard and/or directly between adjacent stand-offs.
 73. Amicroelectronic imaging unit, comprising: a support member; an imagingdie attached to the support member, the imaging die comprising an imagesensor, an integrated circuit operably coupled to the image sensor, anda plurality of external contacts operably coupled to the integratedcircuit; a cover positioned over the image sensor; means for supportingthe cover attached to the support member, the means for supporting thecover being spaced apart to define openings; and a flowable materialdisposed in the openings between the means for supporting the cover. 74.The microelectronic imaging unit of claim 73 wherein the means forsupporting the cover comprise a plurality of stand-offs attached to thesupport member and spaced apart to define the openings.
 75. Themicroelectronic imaging unit of claim 73 wherein: the support memberincludes a plurality of terminals arranged in an array; and the imagingunit further comprises a plurality of wire-bonds electrically couplingthe contacts on the die to corresponding terminals on the supportmember, the individual wire-bonds including a distal end attached to thecorresponding terminal, and at least some of the distal ends arepositioned outboard and/or directly between adjacent means forsupporting the cover.
 76. The microelectronic imaging unit of claim 73wherein the support member includes a plurality of terminals arranged inan array, and at least some of the terminals are positioned outboardand/or directly between adjacent means for supporting the cover.